TMS SERIES

TMS series, a patented technology of XTG Technology, is a fully automatic thermal characteristic warpage analysis equipment for analyzing warpage characteristics according to temperature. In order to eliminate the issue of warpage value distortion at the level of tens of microns caused by the existing white paint application, the thermally deformed warpage is automatically measured according to the temperature profile after loading the material as it is in-tray without any prior work. Full automation of the semiconductor package reflow thermal strain characterization process was realized by using the high-speed surround DFP 3D moiré technology with sub-micron resolution. In addition, the dynamic profiling provided by TMS is the most effective approach to analyze mechanical behavior induced in real-world processes and operating environments, enabling a better understanding of the interactions between materials, packages, substrates and entire assemblies.

No package pre-processing required

There is no need for all the cumbersome pre-processing of BGA package ICs (manual ball removal, white paint spraying on, manual TC heater tape attachment, manual package loading).

Below 1um, high-resolution thermal warpage analysis system. 

Equipped with sub micron
resolution of high speed 3D scanning (Surrounding Stereo DFP Moire) and automatic package handling technology, TMS is a high-efficiency, high-productivity, cutting-edge fully automatic thermal warpage analysis system that maximizes user convenience.

Innovative “AS-IS” thermal warpage automatic measurement technique

AS-IS, IC package placed on JEDEC tray is loaded in and automatic Pick & Place system move the separate IC packages into the simulation oven and “AS-IS” thermal warpage analysis, which is closer to the actual reflow process, is automatically performed.