MacroEdge TM

Inspection Items

检测Roughness, Sawing Line, Bump Height, Bump Dimension, Bump offset, Bump Pitch, Foreign material, Particles, Marks, Scratches, Discoloration, Mechanical Damage, Chip Out 等。
可根据客户的需求，设计为紧凑型可选项设置。

Specifications
 - Throughput up to 120 wph (10µm)
 - Resolution flexibility (10µm to 0.45µm)
 - Three simultaneous color defect review methods: on-the-fly, 
   high resolution, whole wafer
 - Teams with edge and backside modules for all-surface solution